The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates
Ping Zhang, Guomei Chen, Zifeng Ni, Yongguang Wang, Kang Teng, Shanhua Qian, Da Bian, Yongwu Zhao
Topics & Concepts
Materials scienceChemical-mechanical planarizationGlycineCatalysisHydrogen peroxidePolishingAbrasiveChemical engineeringLayer (electronics)SlurryIonComposite materialChemistryOrganic chemistryAmino acidBiochemistryEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis