Effect and mechanism of cold rolling and aging process on microstructure and properties of columnar grain C70250 copper alloy
Wanneng Liao, Haoqin Yang, Cheng Yi, Jing‐Hua Zheng
Topics & Concepts
Materials scienceAlloyMicrostructureUltimate tensile strengthGrain boundaryMetallurgyElectrical resistivity and conductivityCopperComposite materialDislocationPrecipitationMeteorologyPhysicsElectrical engineeringEngineeringMicrostructure and mechanical propertiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties