Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity
Yuyang Wang, Songli Wang, Robert Parsons, Asher Novick, Vignesh Gopal, Kaylx Jang, Anthony Rizzo, Chia‐Pin Chiu, Kaveh Hosseini, Tim Tri Hoang, Sergey Shumarayev, Keren Bergman
Abstract
Embedded silicon photonics (SiPh) is promising to enable ultra-high bandwidth system-wide connectivity with vastly reduced energy consumption by integrating optics deeply within computing sockets. We present the design and characterization of a dense wavelength-division multiplexing (DWDM) SiPh transceiver chip, featuring a unique architecture in the multi-FSR regime and targeting a shoreline bandwidth density of 2 Tbps/mm with a sub-pJ/b energy consumption, providing a viable path toward die-to-die connectivity at scale.
Topics & Concepts
Bandwidth (computing)Wavelength-division multiplexingPhotonicsDie (integrated circuit)TransceiverEnergy consumptionSilicon photonicsChipMultiplexingComputer scienceMoore's lawSiliconOptoelectronicsEngineeringMaterials scienceTelecommunicationsElectrical engineeringWavelengthNanotechnologyWirelessPhotonic and Optical DevicesSemiconductor Lasers and Optical DevicesAdvanced Photonic Communication Systems