Fan-out panel-level package warpage and reliability analyses considering the fabrication process
Chia-Wei Liang, Yu‐Chi Sung, Sheng‐Jye Hwang, Ming‐Hsiang Shih, Wen‐Hsiang Liao, Te-Hsun Lin, Dongyan Yang
Topics & Concepts
Materials scienceReliability (semiconductor)FabricationProcess (computing)Reliability engineeringMechanical engineeringComposite materialEngineering drawingComputer scienceEngineeringMedicineAlternative medicinePathologyPhysicsQuantum mechanicsOperating systemPower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvancements in Photolithography Techniques