Strong Mo/Cu interfacial bonding facilitated by consumable Ti interlayer
Mengen Liu, Li Bai, Yongqiang Deng
Topics & Concepts
Materials scienceIntermetallicDiffusion bondingBonding strengthDiffusionMetallurgyJoint (building)Base metalAnodic bondingSolubilityComposite materialSolid solutionAlloyThermodynamicsSiliconPhysical chemistryStructural engineeringPhysicsWeldingEngineeringChemistryAdvanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties