Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Abdellah Salahouelhadj, Mario González, Kris Vanstreels, Geert Van der Plas, G. Beyer, Eric Beyne
Topics & Concepts
Ball grid arrayMaterials scienceFinite element methodDie (integrated circuit)Flip chipThermal expansionBendingComposite materialCurvatureStructural engineeringGeometryMathematicsEngineeringAdhesiveNanotechnologyLayer (electronics)SolderingElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdhesion, Friction, and Surface Interactions