Litcius/Paper detail

Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer

Xundi Zhang, Chenlin Yang, Menglong Sun, Anmin Hu, Ming Li, Liming Gao, Tao Hang, Huiqin Ling

2020Materials Characterization12 citationsDOI

Topics & Concepts

WhiskerMaterials scienceBarrier layerTinLayer (electronics)ElectroplatingAmorphous solidIntermetallicSubstrate (aquarium)MetallurgyCorrosionComposite materialAlloyChemistryOrganic chemistryGeologyOceanographyElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies
Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer | Litcius