Tungsten/copper composite sheets prepared by a novel encapsulation rolling technique
Xingang Wang, Xinzhe Zhang, Lu Zhao, Chong Zhao, Huailong Zhang, DU Ye-zhi, Wen Zhang, Yajie Guo, Peng Cao
Topics & Concepts
Materials scienceComposite numberTungstenAnnealing (glass)Thermal conductivityElectrical resistivity and conductivityComposite materialCopperThermal expansionParticle sizeMetallurgyChemical engineeringElectrical engineeringEngineeringAdvanced materials and compositesElectrical Contact Performance and AnalysisMetal and Thin Film Mechanics