Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling
Long Zhang, Dengjie Xiong, Junfeng Li, Limeng Yin, Zongxiang Yao, Gang Wang, Liping Zhang, Hehe Zhang
Topics & Concepts
WhiskerIntermetallicMaterials scienceTinWhiskersCoatingCopperCoupling (piping)MetallurgyElectromigrationMolecular dynamicsComposite materialAlloyChemistryComputational chemistryElectronic Packaging and Soldering TechnologiesSemiconductor materials and devicesNanomaterials and Printing Technologies