Preventing Void Growth Between Ni3Sn4 and Solder
Michael Njuki, Sanoop Thekkut, Ronit Das, Peter Børgesen, Nikolay Dimitrov
Topics & Concepts
SolderingIntermetallicKirkendall effectMaterials scienceElectroplatingNucleationAnnealing (glass)MetallurgyVoid (composites)Reflow solderingMicroelectronicsComposite materialNanotechnologyAlloyChemistryLayer (electronics)Organic chemistryElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsMetallurgical and Alloy Processes