Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing
Jung Soo Kim, Seung‐Boo Jung, Jeong‐Won Yoon
Topics & Concepts
SolderingMaterials scienceIntermetallicMetallurgySurface finishLayer (electronics)Substrate (aquarium)Surface roughnessDiffusion barrierComposite materialAlloyGeologyOceanographyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrodeposition and Electroless Coatings