A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test
Ping Zhou, Haosong Shi, Lin Wang, Changyu Hou, Lei Meng, Hongyu Di, Dongming Guo
Topics & Concepts
PolishingAsperity (geotechnical engineering)CopperMechanism (biology)Materials scienceChemical-mechanical planarizationMetallurgyEngineering drawingComposite materialEngineeringPhysicsQuantum mechanicsAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices