Microstructure and mechanical properties of copper/al interlayer/graphite joint prepared utilizing “two-stage method” vacuum diffusion bonding
Shiqiang Zhang, Tao Ma, Yüe Zhao, Zhihang Zhang, Wei Shao, Jihua Huang, Xiaohui Zhang, Ye Zheng, Wanli Wang, Jian Yang
Topics & Concepts
MicrostructureCopperMaterials scienceDiffusion bondingDiffusionGraphiteJoint (building)Composite materialStage (stratigraphy)MetallurgyThermodynamicsPhysicsEngineeringBiologyArchitectural engineeringPaleontologyAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis3D IC and TSV technologies