GIA
Fuping Li, Ying Wang, Yuanqing Cheng, Yujie Wang, Yinhe Han, Huawei Li, Xiaowei Li
2022Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design12 citationsDOIOpen Access PDF
Abstract
2.5D chiplet technology is gaining popularity for the efficiency of integrating multiple heterogeneous dies or chiplets on interposers, and it is also considered an ideal option for agile silicon system design by mitigating the huge design, verification, and manufacturing overhead of monolithic SoCs. Although it significantly reduces development costs by chiplet reuse, the design and fabrication of interposers also introduce additional high non-recurring engineering (NRE) costs and development cycles which might be prohibitive for application-specific designs having low volume.
Topics & Concepts
Computer scienceReuseAgile software developmentInterposerOverhead (engineering)Agile manufacturingEmbedded systemSystems engineeringManufacturing engineeringReliability engineeringComputer architectureEngineeringSoftware engineeringOperating systemMaterials scienceComposite materialEtching (microfabrication)Layer (electronics)Waste management3D IC and TSV technologiesInterconnection Networks and SystemsVLSI and FPGA Design Techniques