Optimized Design and Simulation Study of Liquid-Cooled Heat Sink Model for IGBT Module Based on TPMS Structure
Fuyin Wei, Xianglong Sun, Zhuopei Lv, Lixiang Cai, Feiqi Zhai, Chenyang Kong, Shi Jianping, Hua Zhang
Abstract
Abstract In this article, we propose a liquid-cooled heat sink model utilizing a triple periodic minimal surface (TPMS) structure for insulated gate bipolar transistor (IGBT) modules. By using parametric modeling software ntopology, we establish the following three TPMS structures: Schwarz P, Gyroid, and Diamond. Thermal simulation analysis is conducted on the radiator model using ansys fluent. The optimal structural parameters are determined to ensure effective heat dissipation while preventing excessive pump power consumption due to inappropriate inlet flowrates. Simulation results demonstrate that the liquid-cooled radiator with the TPMS structure outperforms conventional radiators in heat transfer efficiency, albeit with higher inlet and outlet pressure drops. Among the TPMS-structured radiators, the Schwarz P configuration exhibits the lowest pressure drop, approximately 20% less than the remaining two, offering superior thermal management advantages.