Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
Materials scienceWaferGrindingSiliconComposite materialAbrasiveDiamondOptoelectronicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research