Using a triblock copolymer as a single additive in high aspect ratio through silicon via (TSV) copper filling
Fuliang Wang, Yuhang Tian, Kang Zhou, Rui Yang, Tian Tan, Yan Wang, Wenhao Yao
Topics & Concepts
Materials scienceCopperEthylene oxideChemical engineeringCopolymerElectrolyteCavitationElectrodeSiliconThrough-silicon viaPoloxamerVoid (composites)MicelleMass transferOxideUltrasonic sensorInterconnectionComposite materialChemistryMetallurgyChromatographyOrganic chemistryAqueous solutionPolymerPhysical chemistryComputer networkEngineeringMechanicsComputer sciencePhysicsAcoustics3D IC and TSV technologiesElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering Technologies