Litcius/Paper detail

Chip-level thermal management in GaN HEMT: Critical review on recent patents and inventions

Mohd Faizol Abdullah, Mohd Rofei Mat Hussin, Muhamad Amri Ismail, Sharaifah Kamariah Wan Sabli

2023Microelectronic Engineering44 citationsDOI

Topics & Concepts

High-electron-mobility transistorMaterials scienceTransistorEngineering physicsChipThermal conductivityThermal management of electronic devices and systemsOptoelectronicsHeat spreaderDiamondNanotechnologyMechanical engineeringComputer scienceElectrical engineeringEngineeringTelecommunicationsHeat sinkComposite materialVoltageGaN-based semiconductor devices and materialsSilicon Carbide Semiconductor TechnologiesSemiconductor materials and devices