Litcius/Paper detail

Main application limitations of lead-free composite solder doped with foreign reinforcements

Guang Chen, Yaofeng Wu

2021Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

SolderingMicrostructureComposite numberMaterials scienceLead (geology)IntermetallicMelting temperatureMetallurgyComposite materialGeologyAlloyGeomorphologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties
Main application limitations of lead-free composite solder doped with foreign reinforcements | Litcius