Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi
A. M. El-Taher, A. F. Razzk
Topics & Concepts
Materials scienceIntermetallicSolderingSupercoolingCreepAlloyMetallurgyDislocationStress (linguistics)Composite materialThermodynamicsPhilosophyPhysicsLinguisticsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy Properties