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Effect of post-bond heat treatment on microstructure and mechanical properties of the wide gap TLP bonded IC10 superalloy with a low boron Ni3Al-based interlayer

Xiong Yue, Fengmei Liu, Qi Li, Hongbo Qin, Haitao Gao, Likun Li, Yaoyong Yi

2020Journal of Manufacturing Processes35 citationsDOI

Topics & Concepts

Materials scienceSuperalloyEutectic systemMicrostructureMetallurgyScanning electron microscopeComposite materialIsothermal processCarbideCreepUltimate tensile strengthAlloyPhysicsThermodynamicsHigh Temperature Alloys and CreepIntermetallics and Advanced Alloy PropertiesAdditive Manufacturing Materials and Processes
Effect of post-bond heat treatment on microstructure and mechanical properties of the wide gap TLP bonded IC10 superalloy with a low boron Ni3Al-based interlayer | Litcius