Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications
Wenhui Zhu, Xiao-Yu Xiao, Zhuo Chen, Gui Chen, Yamei Yan, Liancheng Wang, Gang-Long Li
Topics & Concepts
IndiumMaterials scienceFlip chipInterconnectionOptoelectronicsWaferSolderingComposite materialNanotechnologyLayer (electronics)MetallurgyAdhesiveEngineeringTelecommunicationsElectronic Packaging and Soldering TechnologiesSemiconductor materials and devices3D IC and TSV technologies