Thermal conductivity analysis of a new sub-micron sized polystyrene foam
F.A. Almeida, Hermann Beyrichen, N Dodamani, R. Caps, Anke-Susanne Müller, Roland Oberhoffer
Abstract
New polystyrene (PS) foams with submicron pore sizes and open pore structure are introduced as potential cores for vacuum insulation panels (VIPs). Measurements of the thermal conductivity λ of the air-filled and evacuated PS foams, the influence of temperature T, opacifiers as well as gas pressure p on the thermal conductivity λ are presented. First results of the foam microstructures, as visualized by electron microscopy, confirm that pore sizes below 1 µm can be achieved. Thermal conductivity values of advanced samples in vacuum of about 7 mW/(m·K) were measured.
Topics & Concepts
Materials scienceThermal conductivityPolystyreneComposite materialThermal insulationExpanded polystyreneConductivityMicrostructureThermalPolymerLayer (electronics)ThermodynamicsPhysical chemistryPhysicsChemistryPolymer Foaming and CompositesAerogels and thermal insulationPhase Equilibria and Thermodynamics