Rigid and crosslinkable polyimide curing epoxy resin with enhanced comprehensive performances
Yifan Li, Jiahui Li, Wenhao Zhang, Qiyun Lin, Lingcheng Chen, Zhihuan Weng, Yi Xiao
Topics & Concepts
PolyimideEpoxyMaterials scienceCuring (chemistry)DiamineThermosetting polymerComposite materialMonomerTrifluoromethylPolymer chemistryPolymerOrganic chemistryChemistryAlkylLayer (electronics)Epoxy Resin Curing ProcessesSynthesis and properties of polymersSilicone and Siloxane Chemistry