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Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization

Wengan Wang, Guisheng Zou, Zhongyang Deng, Qiang Jia, Bin Feng, Lei Liu

2024Journal of Electronic Materials11 citationsDOI

Topics & Concepts

Substrate (aquarium)Materials scienceOxygenSolid-state physicsChemical engineeringChemistryNanotechnologyOrganic chemistryGeologyCondensed matter physicsOceanographyEngineeringPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties
Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization | Litcius