Litcius/Paper detail

Materials for interconnects

Daniel Gall, J. Judy, Zhihong Chen, Hyeuk Jin Han, Christopher L. Hinkle, Joshua A. Robinson, Ravishankar Sundararaman, Riccardo Torsi

2021MRS Bulletin108 citationsDOI

Topics & Concepts

ScatteringMaterials scienceConductorGrain boundaryElectrical conductorElectron scatteringElectrical resistivity and conductivityMean free pathGrain sizeSpecular reflectionInterconnectionEddy currentCondensed matter physicsElectronConductivityEngineering physicsComposite materialOpticsElectrical engineeringPhysicsMicrostructureEngineeringQuantum mechanicsComputer networkComputer scienceGraphene research and applicationsSemiconductor materials and devicesCopper Interconnects and Reliability
Materials for interconnects | Litcius