Effect of ethylenediamine on CMP performance of ruthenium in H<sub>2</sub>O<sub>2</sub>-based slurries
Yi Xu, Tengda Ma, Yuling Liu, Baimei Tan, Shihao Zhang, Yazhen Wang, Guoqiang Song
Abstract
copper, the corrosion inhibitors for copper were added. As a consequence, the removal rate selectivity of 1.13 : 1 was obtained, while also reducing the corrosion potential difference between ruthenium and copper to 17 mV.
Topics & Concepts
RutheniumRuthenium oxideChemical-mechanical planarizationMaterials scienceCorrosionCopperInorganic chemistryEthylenediamineChemistryChemical engineeringMetallurgyCatalysisOrganic chemistryPolishingEngineeringAdvanced Surface Polishing TechniquesCorrosion Behavior and InhibitionSemiconductor materials and devices