Material removal mechanism and subsurface characteristics of silicon 3D nanomilling
Jiqiang Wang, Yongda Yan, Chen Li, Yanquan Geng
Topics & Concepts
Materials scienceShearing (physics)MachiningChip formationVibrationComposite materialSiliconExtrusionAmplitudeStrain rateMetallurgyAcousticsTool wearOpticsPhysicsAdvanced Surface Polishing TechniquesForce Microscopy Techniques and ApplicationsIntegrated Circuits and Semiconductor Failure Analysis