Removal mechanism on 4H–SiC single crystal by picosecond laser ablation-assisted chemical mechanical polishing (CMP)
Haixu Liu, Zhipeng Li, Jiejing Li, Huayang Wu, Dunwen Zuo
Topics & Concepts
Materials scienceAblationComposite materialLaser ablationAbrasivePolishingChemical-mechanical planarizationSingle crystalSofteningLaserOpticsCrystallographyAerospace engineeringChemistryPhysicsEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchLaser Material Processing Techniques