Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
Chen Wang, Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou
Topics & Concepts
Flip chipMaterials scienceThermal greaseThermal contactThermal conductivityThermal contact conductanceThermalHeat transferHeat transfer coefficientComposite materialThermal conductionLayer (electronics)ThermodynamicsThermal resistanceMechanicsAdhesivePhysicsAdhesion, Friction, and Surface InteractionsThermal properties of materialsHeat Transfer and Optimization