The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C–800 °C
Dandan Zhao, Weijia Guo, Zhichao Shang, Chengyi Xu, Xinran Gao, Xiaohong Wang
Topics & Concepts
IntermetallicMaterials scienceDiffusionPhase (matter)CopperKineticsMicrostructureLayer (electronics)AluminiumKinetic energyMetallurgyComposite materialThermodynamicsChemistryPhysicsAlloyOrganic chemistryQuantum mechanicsAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesMicrostructure and mechanical properties