A novel composite bionic leaf vein and honeycomb microchannel heat sink applied for thermal management of electronic components
Linfei Yue, Cong Qi, Maoqing Tang
Topics & Concepts
Heat sinkMicrochannelMaterials scienceComposite numberThermal management of electronic devices and systemsHoneycombThermalMechanical engineeringComposite materialNanotechnologyEngineeringThermodynamicsPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms