Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition
Shengli Li, Chunjin Hang, Wei Zhang, Qilong Guan, Xiaojiu Tang, Dan Yu, Ying Ding, Xiu‐Li Wang
Topics & Concepts
SolderingThermal shockMaterials scienceMetallurgyShock (circulatory)ThermalCurrent (fluid)Composite materialEngineeringThermodynamicsMedicineInternal medicinePhysicsElectrical engineeringElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure AnalysisAdvancements in Semiconductor Devices and Circuit Design