Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving
Fangfang Liu, Weiping Chen, Bingbing Wan, Huanda Chen, Zicheng Ling, Zhiping Chen, Zhiqiang Fu
Abstract
In this paper, a method of ball milling and sieving is proposed for recovery of high-grade copper from waste printed circuit boards (WPCBs). The effects of the milling time on the metals grade and recovery of the Cu, Sn and Pb during mechanical treatment were investigated. The results showed that, after 3 cycles of ball milling and sieving, the content of Cu was enriched to 94.72 wt.% from the initial 74.22 wt.% with a high recovery rate of 86.78%. Moreover, the contents of Sn and Pb were enriched to 28.27 wt.% and 18.86 wt.% from 10.13 wt.% and 6.63 wt.% in the by-products, respectively. However, excessive grinding occurred when the milling time was longer than 3 h and led to a sharp decrease in Cu recovery. The X-ray diffraction (XRD) patterns indicated that the metal phases mainly comprised pure Cu, Sn, Pb in the WPCB particles, while a Cu-Sn alloy was formed during the milling process, and the Cu-Sn alloy was also enriched in the tailings. The results presented here establish that ball milling and sieving is an alternative approach to recovering high-grade copper from WPCBs.