Effects of alloying elements in high reliability copper wire bond material for high temperature applications
Motoki Eto, Noritoshi Araki, Takashi Yamada, Robert Klengel, Sandy Klengel, Matthias Petzold, Masaaki Sugiyama, Shinji Fujimoto
Topics & Concepts
Wire bondingPassivationMaterials scienceCorrosionIntermetallicCopperMetallurgyCopper wireReliability (semiconductor)Composite materialLayer (electronics)AlloyEngineeringElectrical engineeringPhysicsChipQuantum mechanicsPower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties