Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe
Abstract
The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a high-angle grain boundary. An amount of 0.1% proof stress of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at a strain rate of 2.0 × 10−1 s−1. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on tensile strength is negligible at both 25 °C and 175 °C. The elongation of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at 25 °C according to the fracture mode change from ductile chisel point fracture to shear fracture. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on the elongation is negligible at 175 °C. The low cycle fatigue test result shows that the fatigue life does not degrade even at 175 °C in all alloys investigated. The fatigue life of Sn-6.4Sb-3.9Ag-0.4Ni (mass%) is superior to those of Sn-6.4Sb-3.9Ag and Sn-6.4Sb-3.9Ag-0.03Ni (mass%) in the high cycle fatigue area. The electron back scattering diffraction (EBSD) analysis result shows that fine recrystallized grains are generated at the cracked area in Sn-6.4Sb-3.9Ag-0.4Ni in the fatigue test at 175 °C, and the crack progresses in a complex manner at the grain boundaries.