Litcius/Paper detail

Deformation mechanisms and strain rate sensitivity of bimodal and ultrafine-grained copper

J. Bach, Michael Stoiber, L. Schindler, Heinz Werner Höppel, Mathias Göken

2020Acta Materialia53 citationsDOI

Topics & Concepts

Materials scienceStrain rateMicrostructureDislocationDeformation (meteorology)Deformation mechanismGrain Boundary SlidingGrain boundaryGrain sizeMetallurgySevere plastic deformationComposite materialDislocation creepAccumulative roll bondingDuctility (Earth science)CreepMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesMetal and Thin Film Mechanics