Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface
Anil Kunwar, Johan Hektor, Sukeharu Nomoto, Yuri Amorim Coutinho, Nele Moelans
Topics & Concepts
Materials scienceIntermetallicSolderingTemperature gradientFinite element methodPhase (matter)DiffusionWork (physics)MetallurgyComposite materialThermodynamicsChemistryQuantum mechanicsOrganic chemistryAlloyPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesMetallurgy and Material Forming