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Gate-Induced Drain Leakage in Negative Capacitance FinFETs

Amol D. Gaidhane, Girish Pahwa, Amit Verma, Yogesh Singh Chauhan

2020IEEE Transactions on Electron Devices29 citationsDOI

Abstract

In this article, we analyze the issue of gate-induced-drain-leakage (GIDL) in metal-ferroelectric-insulator-semiconductor (MFIS)-type negative capacitance fin field-effect transistor (NC-FinFET) using 3-D technology computer-aided design (TCAD) simulations. We present a comprehensive analysis of GIDL characteristics on 7-nm technology node with respect to the variation of ferroelectric and silicon body thicknesses, source/drain junction placement, and source/drain doping concentration of NC-FinFET. We find that in NCFET, steeper energy band profiles near the source and drain side caused by fringing field coupling to the ferroelectric result in a prior and larger onset of the longitudinal band to band tunneling (L-BTBT) current compared to the baseline FinFET. Also, we find that, unlike the conventional FinFET, NC-FinFET shows the nonmonotonic trend in the occurrence of the L-BTBT component as we scale down the channel length of the device due to the reverse short channel effect.

Topics & Concepts

Materials scienceNegative impedance converterOptoelectronicsLeakage (economics)FerroelectricityQuantum tunnellingDrain-induced barrier loweringTransistorReverse short-channel effectField-effect transistorCapacitanceMOSFETElectrical engineeringDopingShort-channel effectVoltageEngineeringPhysicsDielectricVoltage sourceElectrodeQuantum mechanicsEconomicsMacroeconomicsFerroelectric and Negative Capacitance DevicesSemiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit Design
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