Litcius/Paper detail

Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon

Florian Wallburg, Meinhard Kuna, Michael Budnitzki, Stephan Schoenfelder

2020Wear34 citationsDOI

Topics & Concepts

Materials scienceDiamondSiliconAbrasiveCrackingFinite element methodComposite materialStructural engineeringMetallurgyEngineeringAdvanced Surface Polishing TechniquesMetal and Thin Film MechanicsAdvanced machining processes and optimization