Covalent bond-assisted continuous interface structure for high thermal conductive polyimide composite films
Fan Wang, Xiaodi Dong, Guangyi Liu, Baoquan Wan, Jinghui Gao, Baixin Liu, Jun‐Wei Zha, Jun‐Wei Zha
Topics & Concepts
Materials sciencePolyimideComposite materialComposite numberCovalent bondElectrical conductorThermalInterface (matter)Layer (electronics)Organic chemistryCapillary actionChemistryMeteorologyCapillary numberPhysicsSynthesis and properties of polymersAdvanced Sensor and Energy Harvesting MaterialsConducting polymers and applications