The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn–25Sb-xAg high temperature lead-free solder
Chao‐Jun Li, Yanfu Yan, Tingting Gao, Guodong Xu
Topics & Concepts
SolderingMicrostructureMaterials scienceAlloyIntermetallicUltimate tensile strengthDifferential scanning calorimetryMetallurgyScanning electron microscopeTensile testingOptical microscopeVickers hardness testMelting pointComposite materialPhysicsThermodynamicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties