Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium - based copper interconnected and the surface action mechanism analysis
Fu Luo, Xinhuan Niu, Han Yan, Yinchan Zhang, Minghui Qu, Yebo Zhu, Ziyang Hou
Topics & Concepts
Chemical-mechanical planarizationAdsorptionMaterials scienceCopperPassivationCorrosionPhytic acidInorganic chemistryChemical engineeringMetallurgyComposite materialChemistryOrganic chemistryPolishingLayer (electronics)BiochemistryEngineeringAdvanced Surface Polishing TechniquesCopper Interconnects and ReliabilityIntegrated Circuits and Semiconductor Failure Analysis