Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength
Jiabin Hu, Yajing Wu, Cong Li, Laili Wang, Shenghe Wang, Zhongqi Shi
Topics & Concepts
Materials scienceComposite materialFOIL methodThermal conductivitySilicon nitrideLayer (electronics)MicrostructureCopperdBcOxideSiliconMetallurgyOptoelectronicsCMOSAdvanced ceramic materials synthesisAluminum Alloys Composites PropertiesThermal properties of materials