Dynamic thermal management with variable conductance heat pipes in high-power devices: Balancing dew prevention and heat dissipation
Jingjing Bai, Yincai Zhao, Fangqiong Luo, Tong Sun, Zhijie Li, Yiming Li, Tang Yong, Shiwei Zhang
Topics & Concepts
Thermal management of electronic devices and systemsDewDissipationMechanicsHeat pipeThermal resistanceMaterials scienceEnvironmental sciencePower (physics)ThermodynamicsHeat transferNuclear engineeringEngineeringMechanical engineeringPhysicsCondensationHeat Transfer and OptimizationHeat Transfer and Boiling StudiesSilicon Carbide Semiconductor Technologies