Thermo-curable and photo-patternable polysiloxanes and polycarbosiloxanes by a facile Piers–Rubinsztajn polycondensation and post-modification
Wenjie Fan, Nianmin Hong, Quan Sun, Menglu Li, Wenxin Fu
Abstract
A series of BCB-functionalized organosilicon materials were prepared by a facile Piers–Rubinsztajn polycondensation and Heck coupling post-modification method, rendering a simple and efficient option for advanced packaging dielectric materials.
Topics & Concepts
OrganosiliconCondensation polymerMaterials scienceHeck reactionPolymer chemistryPolymer scienceComposite materialOrganic chemistryChemistryPolymerPalladiumCatalysisSynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes