Effects of the grain size and orientation of Cu on the formation and growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints
Da-Gyeong Han, Jeong-Won Yoon
Topics & Concepts
IntermetallicSolderingMaterials scienceMetallurgyGrain sizeGrain growthCopperAlloyElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis