Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating
Zhen Li, Baizhao Tan, Jiye Luo, Jinfeng Qin, Guannan Yang, Chengqiang Cui, Pan Li
Topics & Concepts
Materials scienceCopperCopper platingElectroplatingElectrochemistryPlating (geology)Chemical engineeringMetallurgyNanotechnologyChemistryLayer (electronics)ElectrodeGeophysicsPhysical chemistryGeologyEngineeringElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfaces