Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis
Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia
Topics & Concepts
Materials scienceFracture toughnessStrain energy release rateComposite materialDelamination (geology)Fracture mechanicsFracture (geology)Finite element methodToughnessMolding (decorative)BendingStructural engineeringEngineeringTectonicsBiologySubductionPaleontologyMechanical Behavior of CompositesElectronic Packaging and Soldering TechnologiesMechanical stress and fatigue analysis