Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride–Urea Deep Eutectic Solvents
Xiaozhou Cao, Lulu Xu, Chao Wang, Siyi Li, Dong Wu, Yuanyuan Shi, Fengguo Liu, Xiangxin Xue
Abstract
The electrochemical behavior and electrodeposition of Sn were investigated in choline chloride (ChCl)–urea deep eutectic solvents (DESs) containing SnCl2 by cyclic voltammetry (CV) and chronoamperometry techniques. The electrodeposition of Sn(II) was a quasi-reversible, single-step two-electron-transfer process. The average transfer coefficient and diffusion coefficient of 0.2 M Sn(II) in ChCl–urea at 323 K were 0.29 and 1.35 × 10−9 cm2∙s−1. The nucleation overpotential decreased with the increase in temperature and SnCl2 concentration. The results of the chronoamperometry indicated that the Sn deposition on tungsten electrode occurred by three-dimensional instantaneous nucleation and diffusion controlled growth using the Scharifker–Hills model. Scanning electron microscopy (SEM) showed that the morphology of the deposits is uniform, as a dense and compact film prepared by potentiostatic electrolysis on Cu substrate. X-ray diffraction (XRD) analysis revealed that the deposits were pure metallic Sn.